Integral Ventures is pleased to announce that it has invested in Eshylon Scientific, which is revolutionizing thin wafer handling and the temporary bonding market for large semiconductor manufacturers with its innovative, multi-patented Mobile Electrostatic Carriers (MESCs). The Eshylon MESC platform solves a very hard problem of handling ultra-delicate thin wafers used in mobile devices, automobiles, IoT, sensors and MEMS applications.
Eshylon VP of Business Development Charles Maschal said “it’s been great to work with Integral Ventures as we’ve launched our game-changing product platform into the market. We’ve found the right partner to help us grow.”
With over a dozen patents and customers that include the world’s biggest semiconductor users, Eshylon’s temporary bonding technology delivers unmatched ROI for thin wafer handling, fab retrofit and wafer thinning applications through extraordinary yield, versatility, cost and throughput.
“Rarely do we see a product that has a 90% first meeting adoption rate amongst customers, but it’s a credit to the team at Eshylon that they’ve solved an extraordinarily difficult problem for large-scale chip makers,” said Integral Life CEO Robb Smith. “Eshylon is enabling the next generation of chips that rely on advanced packaging to move beyond Moore’s Law.”
For more information, see http://www.eshylon.com/